The solder based self assembly (SBSA) method is used to fabricate on-chip 3D structures. Different types of soldering were investigated: Face and edge soldering. The 3D solder filled structures is currently fabricated on through silicon vias (TSVs) and envisioned as interposts in connecting hybrid technologies. A recent link of solder self assembly video is shown in the link. Three journal articles are published on this topic: 1, 2, and 3. These three articles talks on solder assisted self assembly process and improving the yield by refining dip soldering parameters. Various design parameters influencing the solder bridging and in-turn improves the self folding mechanism are disccused in these journal articles. The fourth article submitted to Elsevier publications discusses the processing, designing and reliability of SBSA structures on buried channel in detail. My recent talk in ICMCTF international conference, April, 2012 can be found here. Few SBSA 3D structures are shown below.